HP Latex 260 Maintenance and troubleshooting guide - Page 52

The various settings mentioned above are described below., Substrate settings, Substrate

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Substrate family Textile Film Synthetic paper Paperaqueous Papersolvent Low-temp. Mesh Warm-up drying temperatur e offset Warm-up curing temperatur e Warm-up curing temperatur e offset Cool-down drying temperatur e Cool-down drying temperatur e offset Cool-down curing temperatur e Cool-down curing temperatur e offset 5 85 0 80 0 90 0 5 85 0 80 0 100 0 5 80 0 75 0 85 0 5 60 0 75 0 85 0 10 75 0 75 0 90 0 10 80 0 75 0 85 0 10 85 0 80 0 85 0 Minimum drying power 0.7 0.7 0 0 0.7 0 0.7 The various settings mentioned above are described below. Setting Warm-up drying temperature Warm-up drying temperature offset Warm-up curing temperature Warm-up curing temperature offset Cool-down drying temperature Cool-down drying temperature offset Cool-down curing temperature Description If too low If too high The base temperature that the substrate in the print zone must reach before printing starts. This setting is determined by the RIP. You cannot change it. This offset is added to the base warm-up drying temperature, and the total is displayed in the front panel while the printer is preparing to print. Bleeding or coalescence may appear in the first 200-300 mm of the print. A longer time to start printing is required. Vertical banding or ink smears may occur. The base temperature that the substrate in the curing zone must reach before printing starts. This setting is determined by the printer. You cannot change it. This offset is added to the base warm-up curing temperature, and the total is displayed in the front panel while the printer is preparing to print. The beginning of the print is not fully dry, or looks oily. Substrate degradation (blisters, adhesive detachment) at the beginning of the print. The base temperature at which the substrate can be under the drying module without being damaged. At the end of a job, the substrate is not stopped until this temperature is reached. This setting is determined by the printer. You cannot change it. This offset is added to the base cool-down drying temperature. A long time is needed to finish the print. The substrate at the beginning of the next print may be damaged, because it has stopped moving under too high a temperature. This case is uncommon. The base temperature at which the substrate can be under the curing module without being damaged. At the end of a job, the substrate is not stopped until this temperature is reached. This setting is determined by the printer. You cannot change it. 46 Chapter 5 Substrate settings ENWW

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Substrate
family
Warm-up
drying
temperatur
e offset
Warm-up
curing
temperatur
e
Warm-up
curing
temperatur
e offset
Cool-down
drying
temperatur
e
Cool-down
drying
temperatur
e offset
Cool-down
curing
temperatur
e
Cool-down
curing
temperatur
e offset
Minimum
drying
power
Textile
5
85
0
80
0
90
0
0.7
Film
5
85
0
80
0
100
0
0.7
Synthetic
paper
5
80
0
75
0
85
0
0
Paper-
aqueous
5
60
0
75
0
85
0
0
Paper-
solvent
10
75
0
75
0
90
0
0.7
Low-temp.
10
80
0
75
0
85
0
0
Mesh
10
85
0
80
0
85
0
0.7
The various settings mentioned above are described below.
Setting
Description
If too low
If too high
Warm-up drying
temperature
The base temperature that the
substrate in the print zone must
reach before printing starts.
This setting is determined by the RIP. You cannot change it.
Warm-up drying
temperature offset
This offset is added to the base
warm-up drying temperature, and
the total is displayed in the front
panel while the printer is
preparing to print.
Bleeding or coalescence may
appear in the first 200-300 mm of
the print.
A longer time to start printing is
required. Vertical banding or ink
smears may occur.
Warm-up curing
temperature
The base temperature that the
substrate in the curing zone must
reach before printing starts.
This setting is determined by the printer. You cannot change it.
Warm-up curing
temperature offset
This offset is added to the base
warm-up curing temperature, and
the total is displayed in the front
panel while the printer is
preparing to print.
The beginning of the print is not
fully dry, or looks oily.
Substrate degradation (blisters,
adhesive detachment) at the
beginning of the print.
Cool-down drying
temperature
The base temperature at which
the substrate can be under the
drying module without being
damaged. At the end of a job, the
substrate is not stopped until this
temperature is reached.
This setting is determined by the printer. You cannot change it.
Cool-down drying
temperature offset
This offset is added to the base
cool-down drying temperature.
A long time is needed to finish the
print.
The substrate at the beginning of
the next print may be damaged,
because it has stopped moving
under too high a temperature. This
case is uncommon.
Cool-down curing
temperature
The base temperature at which
the substrate can be under the
curing module without being
damaged. At the end of a job, the
substrate is not stopped until this
temperature is reached.
This setting is determined by the printer. You cannot change it.
46
Chapter 5
Substrate settings
ENWW