HP Latex 260 Maintenance and troubleshooting guide - Page 51

Change settings while printing, Advanced settings, Disable extra PH cleaning

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● The stop at the right-hand end of the spindle has two possible positions on the spindle. Always use the leftmost position if possible. Use the rightmost position only if the substrate roll requires the full width of the spindle. ● Turn off the substrate-advance sensor (OMAS) in the RIP if the substrate is transparent or dark, or if the printer recommends you to do so. ● Align the printheads. 2. Open the HP diagnostic chart in the RIP. The chart is stored in your printer, at http://ip-addr/hp/device/ webAccess/images/new.tif, where ip-addr is the IP address of your printer. You can also find it at http://www.hp.com/go/L26500/manuals/ and http://www.hp.com/go/L26100/manuals/. 3. Select a suitable number of passes for the substrate family. See Select the number of passes on page 47. 4. Print the plot. Change settings while printing You can use the front panel to change the following settings while printing. ● To change temperature and vacuum settings while printing: select the icon, then Image quality maintenance > Adjust printing params, and choose the setting that you want to adjust. You can use the arrow keys to adjust the curing temperature, the drying temperature or the vacuum pressure. The changes that you make take effect immediately, but they are not saved: the next job will use the settings in the media profile as usual. ● To change substrate advance calibration while printing (in case of banding): select the icon, then Image quality maintenance > Substrate advance calib > Adjust substrate advance. You can use the arrow keys to adjust the substrate advance. The changes that you make take effect immediately, but they are not saved for the next job. See also Substrate advance adjustment on the fly on page 56. ● To enable or disable extra printhead cleaning while printing: select the icon, then Image quality maintenance > Enable extra PH cleaning or Disable extra PH cleaning. In this case, the change of setting is saved for subsequent jobs. NOTE: Extra printhead cleaning shortens the life of the printhead cleaning cartridge. Advanced settings Here are some more advanced settings, which you are not recommended to change, unless you have problems that you cannot resolve any other way. The drying and curing temperatures used by the printer are determined by adding the offset to the base temperature. The base temperatures shown in the table are the default values for each substrate family, but may be changed by the printer depending on the printer settings in use. You cannot change the base temperatures yourself, but you can change the offsets. The base warm-up drying temperature is determined by the RIP. Your RIP may have an option to return all settings to their default values. Substrate family Selfadhesive Banner Warm-up drying temperatur e offset Warm-up curing temperatur e Warm-up curing temperatur e offset Cool-down drying temperatur e Cool-down drying temperatur e offset Cool-down curing temperatur e Cool-down curing temperatur e offset 10 95 0 80 0 95 0 Minimum drying power 0.7 10 95 0 80 0 90 0 0.7 ENWW Add a new substrate 45

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●
The stop at the right-hand end of the spindle has two possible positions on the spindle. Always use
the leftmost position if possible. Use the rightmost position only if the substrate roll requires the
full width of the spindle.
●
Turn off the substrate-advance sensor (OMAS) in the RIP if the substrate is transparent or dark, or
if the printer recommends you to do so.
●
Align the printheads.
2.
Open the HP diagnostic chart in the RIP. The chart is stored in your printer, at
http://
ip-addr
/hp/device/
webAccess/images/new.tif
, where
ip-addr
is the IP address of your printer. You can also find it at
go/L26500/manuals/
and
go/L26100/manuals/
.
3.
Select a suitable number of passes for the substrate family. See
Select the number of passes
on page
47
.
4.
Print the plot.
Change settings while printing
You can use the front panel to change the following settings while printing.
●
To change temperature and vacuum settings while printing: select the
icon, then
Image quality
maintenance
>
Adjust printing params
, and choose the setting that you want to adjust. You can use
the arrow keys to adjust the curing temperature, the drying temperature or the vacuum pressure. The
changes that you make take effect immediately, but they are not saved: the next job will use the
settings in the media profile as usual.
●
To change substrate advance calibration while printing (in case of banding): select the
icon, then
Image quality maintenance
>
Substrate advance calib
>
Adjust substrate advance
. You can use the
arrow keys to adjust the substrate advance. The changes that you make take effect immediately, but
they are not saved for the next job. See also
Substrate advance adjustment on the fly
on page
56
.
●
To enable or disable extra printhead cleaning while printing: select the
icon, then
Image quality
maintenance
>
Enable extra PH cleaning
or
Disable extra PH cleaning
. In this case, the change of
setting
is
saved for subsequent jobs.
NOTE:
Extra printhead cleaning shortens the life of the printhead cleaning cartridge.
Advanced settings
Here are some more advanced settings, which you are not recommended to change, unless you have
problems that you cannot resolve any other way.
The drying and curing temperatures used by the printer are determined by adding the offset to the base
temperature. The base temperatures shown in the table are the default values for each substrate family, but
may be changed by the printer depending on the printer settings in use. You cannot change the base
temperatures yourself, but you can change the offsets. The base warm-up drying temperature is determined
by the RIP.
Your RIP may have an option to return all settings to their default values.
Substrate
family
Warm-up
drying
temperatur
e offset
Warm-up
curing
temperatur
e
Warm-up
curing
temperatur
e offset
Cool-down
drying
temperatur
e
Cool-down
drying
temperatur
e offset
Cool-down
curing
temperatur
e
Cool-down
curing
temperatur
e offset
Minimum
drying
power
Self-
adhesive
10
95
0
80
0
95
0
0.7
Banner
10
95
0
80
0
90
0
0.7
ENWW
Add a new substrate
45