Intel BX80570E8200 Mechanical Design Guidelines - Page 58
Shock Test Procedure
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ATX Thermal/Mechanical Design Information Figure 6-3. Random Vibration PSD 0.1 (5, 0.01) 0.01 3.13GRMS (10 minutes per axis) (20, 0.02) (500, 0.02) PSD (g^2/Hz) 0.001 1 5 Hz 10 100 Frequency (Hz) 500 Hz 1000 6.3.1.2 Shock Test Procedure Recommended performance requirement for a motherboard: Quantity: 3 drops for + and - directions in each of 3 perpendicular axes (i.e., total 18 drops). Profile: 50 G trapezoidal waveform, 170 in/sec minimum velocity change. Setup: Mount sample board on test fixture. Figure 6-4. Shock Acceleration Curve 60 A c c 50 e l 40 e r 30 a t 20 i o n 10 (g) 0 0 2 4 6 8 10 12 Time (m illiseconds) 58 Thermal and Mechanical Design Guidelines
ATX Thermal/Mechanical Design Information
58
Thermal and Mechanical Design Guidelines
Figure
6-3. Random Vibration PSD
0.001
0.01
0.1
1
10
100
1000
Frequency (Hz)
PSD (g^2/Hz)
3.13GRMS (10 minutes per axis)
5 Hz
500 Hz
(5, 0.01)
(20, 0.02)
(500, 0.02)
6.3.1.2
Shock Test Procedure
Recommended performance requirement for a motherboard:
Quantity:
3 drops for + and - directions in each of 3 perpendicular axes (i.e.,
total 18 drops).
Profile:
50 G trapezoidal waveform, 170 in/sec minimum velocity change.
Setup:
Mount sample board on test fixture.
Figure
6-4. Shock Acceleration Curve
0
10
20
30
40
50
60
0
2
4
6
8
10
12
Time (milliseconds)
A
c
c
e
l
e
r
a
t
i
o
n
(g)