Intel BX80570E8200 Mechanical Design Guidelines - Page 3

Contents 1 Introduction 11 1.1 Document Goals and Scope 11 1.1.1 1.1.2 1.1.3 Importance of Thermal Management 11 Document Goals 11 Document Scope 12 1.2 References 13 1.3 Definition of Terms 13 2 Processor Thermal/Mechanical Information 15 2.1 Mechanical Requirements 15 2.1.1 Processor Package 15 2.1.2 Heatsink Attach 17 2.1.2.1 General Guidelines 17 2.1.2.2 Heatsink Clip Load Requirement 17 2.1.2.3 Additional Guidelines 18 2.2 Thermal Requirements 18 2.2.1 Processor Case Temperature 18 2.2.2 Thermal Profile 19 2.2.3 Thermal Solution Design Requirements 19 2.2.4 TCONTROL 20 2.3 Heatsink Design Considerations 21 2.3.1 Heatsink Size 22 2.3.2 Heatsink Mass 22 2.3.3 Package IHS Flatness 23 2.3.4 Thermal Interface Material 23 2.4 System Thermal Solution Considerations 24 2.4.1 Chassis Thermal Design Capabilities 24 2.4.2 Improving Chassis Thermal Performance 24 2.4.3 Summary 25 2.5 System Integration Considerations 25 3 Thermal Metrology 27 3.1 Characterizing Cooling Performance Requirements 27 3.1.1 Example 28 3.2 Processor Thermal Solution Performance Assessment 29 3.3 Local Ambient Temperature Measurement Guidelines 29 3.4 Processor Case Temperature Measurement Guidelines 32 4 Thermal Management Logic and Thermal Monitor Feature 33 4.1 Processor Power Dissipation 33 4.2 Thermal Monitor Implementation 33 4.2.1 4.2.2 4.2.3 4.2.4 PROCHOT# Signal 34 Thermal Control Circuit 34 4.2.2.1 Thermal Monitor 34 Thermal Monitor 2 35 Operation and Configuration 36 Thermal and Mechanical Design Guidelines 3