Intel BOXD850EMD2L Product Specification - Page 32

Audio Subsystem

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Intel Desktop Board D850EMD2/D850EMV2 Technical Product Specification 1.10 Audio Subsystem The audio subsystem consists of the following devices: • Intel 82801BA ICH2 • Analog Devices AD1885 analog codec The audio subsystem includes these features: • Split digital/analog architecture for improved signal-to-noise (S/N) ratio: ≥ 85 dB • Power management support for ACPI 1.0 (driver dependant) • 3-D stereo enhancement The audio subsystem supports the following audio interfaces: • ATAPI-style connectors:  CD-ROM  Auxiliary line in • Front panel audio connector, including pins for:  Line out  Mic in • Back panel audio connectors:  Line out  Line in  Mic in Figure 8 is a block diagram of the audio subsystem. 82801BA I/O Controller Hub (ICH2) AC '97 Link AD1885 Audio Codec Line In Line Out Mic In Auxiliary Line In CD-ROM Figure 8. Audio Subsystem Block Diagram OM12338 For information about The location and signal names of the back panel audio connectors Refer to Section 2.8.1, page 54 32

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Intel Desktop Board D850EMD2/D850EMV2 Technical Product Specification
32
1.10 Audio Subsystem
The audio subsystem consists of the following devices:
•
Intel 82801BA ICH2
•
Analog Devices AD1885 analog codec
The audio subsystem includes these features:
•
Split digital/analog architecture for improved signal-to-noise (S/N) ratio:
≥
85 dB
•
Power management support for ACPI 1.0 (driver dependant)
•
3-D stereo enhancement
The audio subsystem supports the following audio interfaces:
•
ATAPI-style connectors:
CD-ROM
Auxiliary line in
•
Front panel audio connector, including pins for:
Line out
Mic in
•
Back panel audio connectors:
Line out
Line in
Mic in
Figure 8 is a block diagram of the audio subsystem.
82801BA
I/O Controller Hub
(ICH2)
OM12338
AC
’
97
Link
AD1885
Audio Codec
Auxiliary Line In
Mic In
Line Out
CD-ROM
Line In
Figure 8.
Audio Subsystem Block Diagram
For information about
Refer to
The location and signal names of the back panel audio connectors
Section 2.8.1, page 54