Foxconn H67S User manual - Page 9
Product Specifications - lga1155 intel h67
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1 1-1 Product Specifications CPU Support LGA1155 socket Intel® CPU Support CPU TDP not over 65W For the latest CPU information, please visit: Chipset http://www.foxconnsupport.com/cpusupportlist.aspx Intel® H67 Memory 2 x 240-pin DDR3 DIMM socket Support up to 16GB of system memory Dual channel DDR3 1333/1066 MHz architecture Audio Realtek ALC888S audio chip: - High Definition Audio - 2/4/5.1/7.1-channel - Support for S/PDIF Out - Support Jack-Sensing function LAN R� eal� tek 8111E �G�i�g�a�b�i�t �L�A�N���c�h�ip� Expansion Slots 1 x PCI Express x16 slot Storage Intel® H67 chipset: - Support 1 x SATA 2.0+2 x SATA 3.0 connectors - 1 x E-SATA connector - 300MB/s data transfer rate (SATA 2.0) - 600MB/s data transfer rate (SATA 3.0) - Support hot plug and NCQ (Native Command Queuing ) USB Support hot plug Support up to 10 x USB 2.0 ports (6 rear panel ports, 2 onboard USB headers supporting 4 extra ports) Support USB 2.0 protocol up to 480Mb/s Internal Connectors 1 x 24-pin ATX main power connector 1 x 4-pin ATX 12V power connector 3 x SATA connectors 2 x USB 2.0 connectors (supporting 4 x USB devices) 1 x CPU fan header (4-pin) 1 x System fan header (4-pin) 1 x Front Panel connector 1 x Speaker connector 1 x Front Audio connector 1 x COM1 Header 1 x S/PDIF_OUT Connector Back Panel 1 x PS/2 keyboard port Connectors 1 x E-SATA port 1 x HDMI port 1 x DVI-I port