Foxconn H55MX-S English Manual. - Page 9
Product Specifications - ddr3
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1 1-1 Product Specifications CPU Support LGA 1156 socket Intel® CPU: Intel® CoreTM i7, CoreTM i5 and CoreTM i3 processors DMI Bus Full duplex up to 10Gb/s each direction Chipset Intel® H55 Memory 2 x 240-pin DDR3 DIMM sockets Support up to 8GB of system memory Dual channel DDR3 1333/1066MHz architecture Audio Realtek 8-channel audio chip High Definition Audio 2/4/5.1/7.1-channel Support for S/PDIF out Support Jack-Sensing function LAN Realtek 10/100/1000Mb/s LAN chip Expansion Slots 1 x PCI Express x16 slots 1 x PCI Express x4 slots 2 x PCI slot Onboard Serial ATA 6 x SATA connectors 300MB/s data transfer rate Support hot plug and NCQ (Native Command Queuing) USB Support hot plug Supports up to 12 x USB 2.0 ports (6 rear panel ports, 3 onboard USB head- ers supporting 6 extra ports) Support USB 2.0 protocol up to 480Mb/s Internal Connectors 1 x 24-pin ATX main power connector 1 x 4-pin ATX 12V power connector 1 x CPU fan header (4-pin) 2 x System fan headers (4-pin) 1 x Floppy Disk drive connector 1 x Front Audio connector 1 x SPDIF-OUT connector 1 x Speaker connector 3 x USB 2.0 connectors (supporting 6 x USB devices) 1 x Front Panel connector 6 x SATA connectors 1 x TPM connector 1 x COM connector 1 x IrDA connector Back Panel 1 x PS/2 port Connectors 1 x Serial port 6 x USB 2.0 ports 1 x DVI-I port 1 x HDMI port 1 x Optical S/PDIF out port