Intel BOXDH67CFB3 Product Specification - Page 11
Product Description - memory
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1 Product Description 1.1 Overview 1.1.1 Feature Summary Table 1 summarizes the major features of the board. Table 1. Feature Summary Form Factor Processor Memory Chipset Graphics Audio Mini-ITX (6.7 inches by 6.7 inches [170.18 millimeters by 170.18 millimeters]) • Intel® Core™ i7, Intel® Core™ i5, and Intel Core™ i3 processors with up to 65W TDP in an LGA1155 socket ― One PCI Express* 2.0 x16 graphics interface ― Integrated memory controller with dual channel DDR3 memory support ― Integrated graphics processing (processors with Intel® Graphics Technology) • Two 240-pin DDR3 SDRAM Dual Inline Memory Module (DIMM) sockets • Support for DDR3 1333 MHz and DDR3 1066 MHz DIMMs • Support for 1 Gb, 2 Gb, and 4 Gb memory technology • Support for up to 16 GB of system memory with two DIMMs using 4 Gb memory technology • Support for non-ECC memory • Support for 1.35 V low voltage JEDEC memory Intel® H67 Express Chipset consisting of the Intel® H67 Express Platform Controller Hub (PCH) • Integrated graphics support for processors with Intel Graphics Technology: ― High Definition Multimedia Interface* (HDMI*) ― DVI-I ― DisplayPort* • Discrete graphics support for PCI Express 2.0 x16 add-in graphics card • 10-channel (8+2) Intel High Definition audio via the Realtek* ALC892 audio codec • 8-channel (7.1) Intel High Definition Audio via the HDMI interface and the DisplayPort interface continued 11