Intel BOXD945GTPL Product Specification - Page 31
LAN Subsystem
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Product Description 1.10 LAN Subsystem The LAN subsystem consists of the following: • Physical layer interface device. As a manufacturing option, the board includes one of the following LAN devices: ⎯ Intel 82562GX/82562GZ PLC for 10/100 Mbits/sec Ethernet LAN connectivity ⎯ Intel 82573E/82573V/82574V for Gigabit (10/100/1000 Mbits/sec) Ethernet LAN connectivity • RJ-45 LAN connector with integrated status LEDs Additional features of the LAN subsystem include: • CSMA/CD protocol engine • LAN connect interface that supports the 82562GX and 82562GZ • PCI Conventional bus power management ⎯ Supports ACPI technology ⎯ Supports LAN wake capabilities 1.10.1 LAN Subsystem Software LAN software and drivers are available from Intel's World Wide Web site. For information about Obtaining LAN software and drivers Refer to Section 1.2, page 15 1.10.2 10/100 Mbits/sec LAN Subsystem The 10/100 Mbits/sec LAN subsystem consists of the following: • Intel 82801G ICH7 • Intel 82562GX/82562GZ PLC • RJ-45 LAN connector with integrated status LEDs. 1.10.2.1 Intel® 82562GX/82562GZ Physical Layer Interface Device The Intel 82562GX provides the following functions: • 10/100 Ethernet LAN connectivity • Full device driver compatibility • Programmable transit threshold • Configuration EEPROM that contains the MAC address The Intel 82562GZ additionally provides Alert Standard Format (ASF) 1.03 support. 31