Dell DAE2P Hardware Reference

Dell DAE2P Manual

Dell DAE2P manual content summary:

  • Dell DAE2P | Hardware Reference - Page 1
    EMC CLARiiON DAE2P and DAE3P Disk-Array Enclosures HARDWARE REFERENCE P/N 300-002-407 REV A04 EMC Corporation Corporate Headquarters: Hopkinton, MA 01748-9103 1-508-435-1000 www.EMC.com
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    of any EMC software described in this publication requires an applicable software license. For the most up-to-date listing of EMC product names, see EMC Corporation Trademarks on EMC.com. All other trademarks used herein are the property of their respective owners. ii DAE2P/DAE3P Hardware
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    shielded cables. Therefore, in order to comply with the FCC regulations, you must use shielded cables with if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications. take adequate measures. DAE2P/DAE3P Hardware Reference iii
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    Standards Certification and Compliance Rackmount disk enclosures are tested and certified for compliance with the international environmental and safety specifications listed below and marked to indicate such compliance and certification as required. Standard Description CSA 22.2 60950 3rd
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    2-5 Setting the enclosure address 2-10 Connecting the DAE2P/DAE3P to the back end bus 2-12 Binding disk modules into RAID groups 2-15 Chapter 3 Servicing a DAE2P/DAE3P Monitoring disk enclosure status 3-2 Handling FRUs 3-6 Replacing or adding a disk module 3-10 Replacing an LCC module 3-17
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    Contents Appendix A Technical specifications Enclosure specifications A-2 Operating limits A-5 Index...i-1 vi DAE2P/DAE3P Hardware Reference
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    (CX300/CX500 storage system) ........ 2-7 2-3 Connecting DAE3P power cords (CX3-80 storage system 2-8 2-4 Setting the enclosure address (EA 2-11 2-5 Connecting a disk enclosure to another FC device 2-12 2-6 Cabling disk enclosures together - two Fibre Channel buses 2-13 2-7 Cabling DAE2Ps/DAE3Ps
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    Contents 3-13 Installing an LCC 3-18 3-14 Reconnecting a copper cable to an LCC 3-19 3-15 Unplugging the AC power cord 3-20 3-16 Removing a power/cooling module 3-21 3-17 Installing a power/cooling module 3-21 3-18 Plugging in the power cord 3-22 viii DAE2P/DAE3P Hardware Reference
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    Preface This manual is your primary source of information about EMC CLARiiON 2- and 4-gigabit UltraPoint disk-array enclosure (DAE2P and DAE3P) hardware. The DAE2P/DAE3P is often called a disk enclosure. Audience Organization This guide is part of the DAE2P and DAE3P documentation set, and is
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    guide EMC Rails and Enclosures (CX-Series Storage Systems) Field Installation Guide (P/N 300-001-799) EMC Rails and Enclosures (CX3-Series Storage Systems) Field Installation Guide (P/N 300-003-630) EMC Navisphere Manager Administrator's Guide ignore the message. x DAE2P/DAE3P Hardware Reference
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    The most up-to-date information about the DAE2P and DAE3P is posted on the EMC Powerlink website. We recommend that you download the latest information before you install or service your enclosure. If you purchased this product from an EMC reseller and you cannot access Powerlink, the latest
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    under which the problem occurred is required. Your suggestions will help us continue to improve the accuracy, organization, and overall quality of user publications. Please send a message to [email protected] with your opinions of this manual. xii DAE2P/DAE3P Hardware Reference
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    cautions WARNING The following warnings and cautions pertain throughout this guide. Trained service personnel only Ground circuit continuity is vital for safe operation . STROMSTREUVERLUST: Gerät muss geerdet werden, bevor es am Stromnetz angeschlossen wird. DAE2P/DAE3P Hardware Reference xiii
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    incident reports, up to date, complete, and accurate. Static precautions EMC incorporates state-of-the-art technology in its designs, including the strap whenever you handle a printed-circuit board. ◆ Unless specifically designed for nondisruptive replacement, never plug or unplug printed-circuit
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    explosion if battery is incorrectly replaced. Replace only with the same or equivalent type recommended by the equipment manufacturer. Discard used batteries according to manufacturer's instructions. DAE2P/DAE3P Hardware Reference xv
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    Warnings and Cautions xvi DAE2P/DAE3P Hardware Reference
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    Invisible Body Tag 1 About DAE2P and DAE3P disk enclosures Topics in this chapter include: ◆ Introduction 1-2 ◆ Link Control Cards (LCCs 1-8 ◆ Disk modules 1-9 ◆ Power supply/system cooling modules 1-11 About DAE2P and DAE3P disk enclosures 1-1
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    EMC® CLARiiON® DAE2P and DAE3P UltraPoint™ (sometimes called "point-to-point") disk-array enclosures are highly available, high-performance, high-capacity storage systems that use a Fibre Channel Arbitrated Loop (FC-AL) as the interconnect interface. An enclosure connects to another DAE
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    speed. 2 Gb processors, enclosures, and disk modules cannot support or operate on a 4 Gb bus. The DAE2P and DAE3P are externally identical except for a distinguishing "4GB" label on the back of DAE3P enclosures. Any DAE2P or DAE3P includes up to fifteen 3.5-inch disk modules. Simple serial cabling
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    About DAE2P and DAE3P disk enclosures For increased clarity, the following figures depict the disk enclosure outside of the rack cabinet. Your disk enclosure may be installed in a rackmount cabinet as shown in Figure 1-1. As shown in Figure 1-2, the front LED display contains two status lights for
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    About DAE2P and DAE3P disk enclosures Power/Cooling Module B Link Control Card B EXP PRI PRI # PRI EXP EXP ! !! ! !! # EXP PRI Power/Cooling Module A Figure 1-3 DAE2P/DAE3P rear components Link Control Card A EMC3232 SPS (Not used in CLARiiON) Expansion (Out) Primary (In) ! !!
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    . LCCs, power/cooling modules, and disk drives - the enclosure's field-replaceable units (FRUs) - plug directly into the midplane. Front bezel The front bezel, shown in Figure 1-6, has a locking latch and an electromagnetic interference (EMI) shield. You must remove the bezel 1-6 DAE2P/DAE3P
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    About DAE2P and DAE3P disk enclosures to remove and install drive modules. EMI compliance requires a properly installed front bezel. Figure 1-6 Disk enclosure front bezel EMC2173 Introduction 1-7
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    About DAE2P and DAE3P disk enclosures Link Control Cards (LCCs) An LCC supports and controls one Fibre Channel bus and monitors the DAE2P/DAE3P. Expansion Link Active LED (Green/Blue) Primary Link Active LED (Green/Blue) EXP PRI PRI Fault LED (Amber) Power LED (Green) EXP ! ! !! ! !! EXP
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    an LCC while the disk enclosure is powered up. Each disk module consists of one disk drive in a carrier. You can add or remove a disk module while the DAE2P/DAE3P is powered up, but should exercise special care when removing modules while they are in use. DAE2P and DAE3P disk modules support dual
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    About DAE2P and DAE3P disk enclosures spindle speed. Figure 1-8 shows different disk modules supported in a DAE2P/DAE3P, and an unsupported ATA module. Fibre Channel 2- and 4-Gb Fibre Channel 2-Gb only Figure 1-8 Disk modules SATA 2- and 4-Gb ATA (Not supported) CL3583 Disk drives DAE2P/DAE3P
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    line cord. Each supply supports a fully configured DAE2P/DAE3P and shares load currents with the other supply. The drives and LCC have individual soft-start switches that protect the disk drives and LCCs if you install them while the disk enclosure is powered up. A FRU (disk, LCC, or power/cooling
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    About DAE2P and DAE3P disk enclosures Power LED (Green) Power Fault LED (Amber) Blower Fault LED (Amber) !! !! ! !! EXP PRI B # PRI EXP A # PRI EXP ! proper connection to the midplane. You can add or remove one power/cooling module in a DAE2P/DAE3P while the system is powered up. 1-12
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    requirements and procedures. Major topics are: ◆ Requirements 2-2 ◆ Installing a disk enclosure in a cabinet 2-3 ◆ Setting up an installed disk enclosure 2-4 ◆ Connecting AC power 2-5 ◆ Setting the enclosure address 2-10 ◆ Connecting the DAE2P/DAE3P to the back end bus 2-12 ◆ Binding
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    with at least one High Speed Serial Data Connector - 2 (HSSDC2) connector (DAE2s and CX-series storage processors require HSSDC connections; CX3-series processors use SFP connectors). The DAE2P/DAE3P does not support cables shorter than 1 meter or longer than 10 meters. EMC supports and can provide
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    DAE2P/DAE3P Interconnections between disk enclosures should maintain LCC consistency; that is, one Fibre Channel (FC) loop should interconnect all and only the LCC As, and the other Fibre Channel loop should interconnect all and only LCC Bs. Connect all cables at both ends, or remove unused cables
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    you use cabinet anti-tip devices, especially if you are installing or removing a disk enclosure in the upper half of the cabinet when the lower half is empty. Setting up an installed disk enclosure Once your DAE2P/DAE3P is properly installed in a cabinet, follow the remaining steps in this chapter
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    Installing a DAE2P/DAE3P Connecting AC power ! CAUTION The disk-array enclosure will power up immediately once you attach it to an active AC power source. Plan your power configuration before connecting to a power distribution unit or
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    . Do not power up a disk enclosure without at least one LCC installed. You can configure a driveless disk enclosure within a Fibre Channel bus. High availability with write-caching requires disks in slots 0-4 in the first disk enclosure (DPE2, DAE, DAE2P, or DAE3P) connected to a storage processor
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    (EA 0, bus 0) to a Standby Power Supply (SPS) for enclosure power. An integrated disk-and-processor enclosure, such as a CX300 or CX500-series DPE2, is always the first disk enclosure on the first bus (0,0). You should not connect any DAE in a DPE2 configuration to an SPS. Connecting AC Power 2-7
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    Installing a DAE2P/DAE3P If you do connect a DAE2P/DAE3P to an SPS (if, for example, the DAE2P/DAE3P is the first disk enclosure in a CX700- or CX3-series configuration), be sure that you maintain power/bus integrity; always connect power module A to SPS A, and module B to SPS B. Figure 2-3 shows
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    cabinet master switch or circuit breakers, which are normally on. As a result, a DAE2P/DAE3P is always active. When you initially apply AC power to a disk enclosure, the disk drive modules power up according to their specifications, and spin up in a staggered sequence. The slot spin-up delays range
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    (loops) from DAE2s to achieve the maximum advantage of their point-to-point fault and data isolation. You should also keep 2 Gb enclosures (any DAE with 2 Gb disks) and 4 Gb DAE3P enclosures on separate buses. (A 4 Gb bus will not recognize 2 Gb devices unless the bus speed is manually reset to the
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    DAE2P/DAE3P ! CAUTION Each drive reads its FC-AL physical address at powerup or when the drive is reset. To avoid losing data, you must set the enclosure address when power is on and the enclosure The second LCC will automatically change to the new value. 1 Bus ID 2 3 Enclosure Address EA
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    a CX-series DPE2 , DAE2, or SPE; use HSSDC2-HSSDC2 cables to connect DAE2Ps and DAE3Ps, and use SFP-HSSDC2 cables to connect to a CX3-series SPE. ! CAUTION Make sure to orient the HSSDC2 connectors as shown in Figure 2-5. The connector thumb clip faces up when connecting to LCC B, and down when
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    and DAE2P/DAE3P enclosures follow the same EA, bus balancing, and cabling conventions whenever possible and practical. The configuration example in Figure 2-6 shows a CX3-series Model 40 storage processor enclosure (SPE3) below eight DAE3P disk-array enclosures. Each of the eight devices supports
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    DAE2P/DAE3P Figure 2-7 shows a more complicated configuration with ten DAE3Ps and four Fibre Channel buses. LCC B B A !! # EA1/Bus 3 EXP PRI PRI ! # PRI EXP EXP LCC !! ! ! ! ! ! ! SPS B SPS A EMC3410 Figure 2-7 Cabling DAE2Ps/DAE3Ps together - four Fibre Channel buses 2-14
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    Installing a DAE2P/DAE3P Binding disk modules into RAID groups After cabling the disk enclosure, use EMC Navisphere® Manager software to bind the disks into RAID groups. Refer to the EMC Navisphere Manager Administrator's Guide and your storage processor configuration and planning guide for detailed
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    Installing a DAE2P/DAE3P • Within any specific capacity, place drives of the highest speed first, followed by drives of lower speed. ◆ You should always use disks of the same speed and capacity in any RAID group. ◆ Do not use ATA or SATA drives to store boot images of an operating system. You must
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    disk enclosure status 3-2 ◆ Handling FRUs 3-6 ◆ Replacing or adding a disk module 3-10 ◆ Replacing an LCC module 3-17 ◆ Replacing a power supply/system cooling module 3-20 For more information about upgrading your DAE2P/DAE3P, contact your service provider. Servicing a DAE2P/DAE3P 3-1
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    Servicing a DAE2P/DAE3P Monitoring disk enclosure status Status lights on the DAE2P/DAE3P and its FRUs indicate error conditions. These lights are visible outside the disk enclosure. Some lights are visible from the front, and the others from the back. Figures Figures 3-1 through 3-4 and Tables
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    Servicing a DAE2P/DAE3P Table 3-1 Status lights visible from the front of the disk enclosure Light Quantity Color Meaning Disk Enclosure Power 1 Green Power to enclosure is on; back-end bus running at 2 Gb/s Blue Power to DAE3P enclosure is on; back-end bus running at 4 Gb/s Disk Enclosure
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    Servicing a DAE2P/DAE3P Figure 3-2 shows the enclosure address and bus ID indicators, visible from the back of the enclosure. In this example, the DAE2P/DAE3P is enclosure 2 on loop (bus) 1; note that the indicators for LCC A and LCC B must always match. Loop ID Enclosure EA Address Selection
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    Power LED (Green) Power Fault LED (Amber) Blower Fault LED (Amber) Servicing a DAE2P/DAE3P !! !! EXP PRI ! B # PRI EXP A # PRI EXP ! EXP PRI !! !! Blower Fault LED or Blue) Active LED (Green or Blue) EMC3184 Figure 3-4 LCC status LEDs Monitoring disk enclosure status 3-5
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    Servicing a DAE2P/DAE3P Table 3-3 describes the status LEDs visible from the rear of the disk enclosure. Table 3-3 Status lights visible from the rear of the disk enclosure Light LCC Power LCC Fault Quantity 1 per LCC 1 per LCC Primary Link Active 1 per LCC Expansion Link Active 1 per LCC
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    Servicing a DAE2P/DAE3P compartments should contain a FRU or filler panel to ensure EMI compliance and proper air flow over the FRUs. While the disk enclosure is powered up, you can service or replace any FRU, although removing an active LCC and understand the following instructions: ◆ Provide enough
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    Servicing a DAE2P/DAE3P ◆ Use the ESD kit when handling any FRU. If an emergency using an ESD wristband. Attach the clip of the ESD wristband to the ESD bracket or bare metal on the enclosure, and put the wristband around your wrist with the metal button against your skin. ◆ Handle FRUs gently. A
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    Servicing a DAE2P/DAE3P ◆ Never use excessive force to remove or install a FRU. ◆ Store a FRU in the antistatic repair. ◆ Store FRUs within the temperature and humidity limits specified in Appendix A. ◆ Place the cables where no one can step on them or roll equipment over them. Handling FRUs 3-9
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    Servicing a DAE2P/DAE3P Replacing or adding a disk module ! CAUTION Disk modules are extremely sensitive electronic components. Always handle a disk module gently, and observe the following guidelines: ◆ Follow the instructions in the preceding section "Avoiding Electrostatic Discharge (ESD)
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    Servicing a DAE2P/DAE3P ◆ Always wear a properly attached ESD wristband when removing or replacing a disk module. ◆ Disk modules are sensitive to the extreme temperatures sometimes encountered during shipping. We recommend that you leave new disk modules in their shipping material and expose the
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    Servicing a DAE2P/DAE3P Unlocking and removing the front bezel Follow these steps to remove the front bezel and gain access to the disk modules. Refer to Figure 3-6. 1. Insert the key that shipped with your enclosure into the bezel lock, and turn it to release the lock. 2. Press the two latch
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    Servicing a DAE2P/DAE3P Removing a disk filler module Locate the slot where you want to install the disk module, and remove the filler module, as shown in Figure 3-7. EMC2210 Figure 3-7 Removing a disk filler module Skip to the disk installation procedure (page 3-14) to install the add-on disk in
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    only 4 Gb disks (with a 2/4 mark on the front label). A DAE2P will support 4 Gb disks at 2 Gb/s. 1. Make sure an ESD wristband is attached to your wrist and the enclosure (see the precautions on page 3-7). 2. Align the module with the guides in the slot. 3-14 DAE2P/DAE3P Hardware Reference
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    Servicing a DAE2P/DAE3P 3. Refer to Figure 3-9 as you insert the new disk module. a. With the disk module latch fully open, gently push the module into the slot. b. The disk module latch will begin to rotate downward when its tabs meet the enclosure chassis. c. Push the handle down to engage the
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    Servicing a DAE2P/DAE3P Installing and locking the front bezel Refer to Figure 3-10 as you do the following: 1. Align the bezel with the disk enclosure. 2. Gently push the bezel into place on the cabinet until it latches. 3. Secure the bezel by turning the key in the lock. Figure 3-10 Installing
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    . A DAE2P or DAE3P must have at least one LCC installed while it is powered up. Do not remove both LCCs while the disk enclosure is powered up. Removing an LCC 1. Gently press the connector latches to release them as you remove the copper cables connected to the LCC, as shown in Figure 3-11. Note
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    the replacement LCC. Installing an LCC 1. Gently insert the LCC as shown in Figure 3-13. Be sure the module is completely seated in the enclosure midplane. !! ! ! !! Captive Screw B A EXP PRI # PRI EXP Figure 3-13 Installing an LCC Captive Screw EMC3181 3-18 DAE2P/DAE3P Hardware Reference
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    Servicing a DAE2P/DAE3P The LCC Power light turns on. 2. Secure the module with the captive screws. 3. Reattach the copper cables to the same connector from which you removed them, as shown in Figure 3-14. ! !! ! !! B A PRI PRI Connector To Previous Enclosure PRI # EXP EXP PRI PRI PRI #
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    a DAE2P/DAE3P Replacing a power supply/system cooling module ! CAUTION Handle a power supply/system cooling (power/cooling) module gently and use an ESD wristband. Do not remove a power/cooling module until you have a replacement module available. Access to the disks in your enclosure will
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    Servicing a DAE2P/DAE3P To protect a running system from overheating, the enclosure will time out unless you replace the power 16 Removing a power/cooling module 3. Gently insert the new power/cooling module into the enclosure, as shown in Figure 3-17. Be sure the module is completely seated. ! !!
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    Servicing a DAE2P/DAE3P 5. Plug the AC power cord into the new supply as shown in Figure 3-18. Generic Plug Retention Bail Retention Bail ! !! B A EXP retention bails at each connector. The bails prevent the power cord from pulling out of the connections. 3-22 DAE2P/DAE3P Hardware Reference
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    Invisible Body Tag Body Tag A Technical specifications This appendix describes the disk-array enclosure technical specifications, operating limits, and shipping and storage requirements. Major topics are: ◆ Enclosure specifications A-2 ◆ Operating limits A-5 Technical specifications A-1
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    the remaining supply and cord supporting the full load. You must use a rackmount cabinet with AC power distribution, and have main branch AC distribution that can handle these values for each disk enclosure in the cabinet. Table A-1 DAE2P/DAE3P AC power specifications Requirement AC line voltage
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    for DAE2P/DAE3P-DAE2P/DAE3P connection; HSSDC2-SFP for DAE2P/DAE3P to CX3-series back-end HSSDC-HSSDC2 for connection to CX-series DPE, SPE, or DAE2 2 meters (6.6 feet);5 meters (16.5 feet) and 8 meters (26.4 feet) Maximum 5-meter support for SFP-HSSDC2 connection Enclosure specifications A-3
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    Rackmount disk enclosures are tested and certified for compliance with the international environmental and safety specifications listed Loop Direct Attach (PLDA), Revision 2.1 In some cases, the DAE2P/DAE3P uses functions from later revisions of specifications. A-4 DAE2P/DAE3P Hardware Reference
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    processors will begin an orderly shutdown that saves cached data, shuts off the SPs, and - in a DPE2 enclosure - powers down the disks. LCCs in each DAE2P/DAE3P will power down their disks but remain powered on. If the system detects that the temperature has dropped to an acceptable level, it
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    Technical specifications Shipping and storage requirements Requirement Ambient temperature Temperature gradient Relative humidity Elevation Description -40oC to 65oC (-40oF to 149oF) 25oC/hr (45oF/hr) 10% to 90% noncondensing 7625 m (25,000 ft) A-6 DAE2P/DAE3P Hardware Reference
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    2-2 cabling precautions 3-9 requirements 2-2 certification DPE2 iv chassis see enclosure check light DAE2P components 3-2 LCC 3-6 power supply 3-6 comments xii compliance DPE2 iv components 1-3 Cooling Check light 3-6 customer support xii D DAE2P (2-gigabit point-to-point disk-array enclosure) disk
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    ) cabling A-3 requirements 2-2 connector A-3 interface specifications A-3 physical address 2-10 Fibre Channel related standards A-4 front bezel description 1-6 unlocking and removing 3-12 FRUs (field-replaceable units) defined 1-3 disk module description 1-9 removing 3-13 i-2 DAE2P/DAE3P Hardware
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    disk module 3-13 replacing LCC 3-17 power supply 3-20 requirements cabling 2-2 S service xii shipping requirements A-6 site requirements 2-2 specifications, DAE2P A-2 standards DPE2 iv status monitoring DAE2P 3-2 status lights, DAE2P 3-2 T technical specifications, DAE2P A-2 technical support
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    Index i-4 DAE2P/DAE3P Hardware Reference
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EMC Corporation
Corporate Headquarters
:
Hopkinton, MA 01748
-
9103
1
-
508
-
435
-
1000
www.EMC.com
EMC CLARiiON
DAE2P and DAE3P Disk-Array Enclosures
HARDWARE REFERENCE
P/N 300-002-407
REV A04